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档案库 · 硬件与设备 · 技术决策 · 2024–2026

韩国iHW押注模拟存内计算:完成520亿韩元A轮融资

来自三星、SK海力士和英特尔的老兵于2024年6月创立iHW,押注能效;其ACiM芯片获得520亿韩元A轮投资,累计融资达640亿韩元。

iHW (아이에이치더블유)

它在赌什么押注AI的下一瓶颈是电力,使用模拟存内计算在成熟制程上打造低功耗芯片,在边缘市场击败数字NPU。在做还没上线

做的是什么生意

An ultra-low-power AI semiconductor fabless company developing the AI chip Infertron with a neuromorphic + analog compute-in-memory architecture, targeting edge AI, humanoid robot SoCs, and data centers.

启动资金Series A of KRW 52 billion (about USD 37.5 million), cumulative fundraising of KRW 64 billion; additionally received more than USD 10 million in support from government AI semiconductor projects.

起因

iHW was founded in June 2024 by senior executives and engineers from global semiconductor companies including Samsung Electronics, SK Hynix, and Intel, starting as a 'next-generation computing architecture' research group. The company targets the AI industry's increasingly severe power consumption and heat dissipation burden: data centers are repeatedly delayed or face resident opposition due to power and cooling issues, while edge AI is constrained by battery capacity.

经过

The company developed the ultra-low-power AI chip Infertron, which uses an analog compute-in-memory structure to perform computation directly at the same location where weights are stored, reducing data movement while lowering power consumption and latency; the chip needs no external DRAM or flash memory, can operate on a single chip, and can be implemented on mature process nodes. In 2025, iHW won multiple government AI semiconductor projects, receiving more than USD 10 million (about KRW 14.1 billion) in funding, and co-developed a low-power SoC for humanoid robots with the Korea Electronics and Telecommunications Research Institute (KETI).

结果

On August 19, 2026, the company announced the completion of a KRW 52 billion Series A round led by Kolon Investment (科隆投资), with existing shareholders Woori Venture Partners, Mirae Asset (未来资产), and DSC Investment following on, Korea Development Bank (韩国产业银行) entering as a new investor, and LIG Defense & Aerospace (LIG防务与航空航天), together with IBK Capital (IBK资本), participating; cumulative fundraising reached KRW 64 billion. The funds will be used for mass production of edge AI chips, pilot production of LLM chips, and market development.

背景

韩国无晶圆厂AI芯片初创公司iHW成立于2024年6月,创始团队来自三星、SK海力士和英特尔,于2026年8月19日完成由Kolon Investment领投的520亿韩元A轮融资,韩国产业银行参投,累计融资达640亿韩元。

iHW押注AI的下一瓶颈是电力,而非算力。数据中心面临电力和冷却延迟,边缘AI受限于电池,而数字NPU在搬运权重时浪费能源。iHW的模拟存内计算(ACiM)在存储位置进行计算,无需外部DRAM,可在成熟节点上运行,且无散热风扇也能保持凉爽。

A轮之前,iHW赢得了2025年政府项目,金额超过1000万美元,并与ETRI共同开发了用于人形机器人的低功耗SoC。Kolon Investment指出,iHW已通过核心模块的硅验证,拥有在智慧城市、工业视觉和机器人等边缘市场的机会,而数字NPU因散热和电池限制无法覆盖这些市场。

这件事要成立,得有什么

  • AI的瓶颈从计算转移到电力:数据中心面临电力延迟,边缘设备受限于电池,使得功耗成为可货币化的痛点。
  • ACiM在权重存储位置计算,节省数据搬运的功耗和延迟,使用成熟节点避免高成本。
  • 来自三星、SK海力士和英特尔的团队带来量产经验和网络,使无晶圆厂模式可信。
  • 政府项目早期验证了技术,因此A轮是在得到验证之后,而非仅凭概念。

可借鉴之处

当竞争对手追逐先进制程时,反其道而行之押注高能效芯片也能融到钱:把功耗和散热当作产品定义,而不是细节。

后续进展

截至2026年8月19日,iHW完成520亿韩元A轮融资,并宣布将资金用于边缘AI芯片的量产、LLM芯片的试产和市场推广以及扩大团队,同时继续推进与ETRI在低功耗人形机器人SoC上的合作。公司尚未披露产品量产时间表或收入;Kolon Investment评估认为,该公司已通过核心模块的硅验证,有潜力获取边缘市场。

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